Bharath Ramakrishnan, Mohammad Tradat, Yaser Hadad, Kanad Ghose, Bahgat Sammakia. Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation. In 17th IEEE International Conference on Industrial Informatics, INDIN 2019, Helsinki, Finland, July 22-25, 2019. pages 1419-1424, IEEE, 2019. [doi]
@inproceedings{RamakrishnanTHG19,
title = {Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation},
author = {Bharath Ramakrishnan and Mohammad Tradat and Yaser Hadad and Kanad Ghose and Bahgat Sammakia},
year = {2019},
doi = {10.1109/INDIN41052.2019.8972030},
url = {https://doi.org/10.1109/INDIN41052.2019.8972030},
researchr = {https://researchr.org/publication/RamakrishnanTHG19},
cites = {0},
citedby = {0},
pages = {1419-1424},
booktitle = {17th IEEE International Conference on Industrial Informatics, INDIN 2019, Helsinki, Finland, July 22-25, 2019},
publisher = {IEEE},
isbn = {978-1-7281-2927-3},
}