Mengyi Ren, Koichi Oka. Design of a Noncontact Bending Testing Device Using Magnetic Levitation Mechanism. IEEE Transactions on Industrial Electronics, 71(2):1697-1707, February 2024. [doi]
@article{RenO24,
title = {Design of a Noncontact Bending Testing Device Using Magnetic Levitation Mechanism},
author = {Mengyi Ren and Koichi Oka},
year = {2024},
month = {February},
doi = {10.1109/TIE.2023.3260358},
url = {https://doi.org/10.1109/TIE.2023.3260358},
researchr = {https://researchr.org/publication/RenO24},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {71},
number = {2},
pages = {1697-1707},
}