Study of anisotropic conductive adhesive joint behavior under 3-point bending

M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu. Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectronics Reliability, 45(3-4):589-596, 2005. [doi]

Authors

M. J. Rizvi

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Y. C. Chan

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C. Bailey

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H. Lu

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