Wearable FPGA Platform for Accelerated DSP and AI Applications

Daniel Roggen, Robert Cobden, Arash Pouryazdan, Muhammad Zeeshan. Wearable FPGA Platform for Accelerated DSP and AI Applications. In 2022 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events, PerCom 2022 Workshops, Pisa, Italy, March 21-25, 2022. pages 66-69, IEEE, 2022. [doi]

@inproceedings{RoggenCPZ22,
  title = {Wearable FPGA Platform for Accelerated DSP and AI Applications},
  author = {Daniel Roggen and Robert Cobden and Arash Pouryazdan and Muhammad Zeeshan},
  year = {2022},
  doi = {10.1109/PerComWorkshops53856.2022.9767398},
  url = {https://doi.org/10.1109/PerComWorkshops53856.2022.9767398},
  researchr = {https://researchr.org/publication/RoggenCPZ22},
  cites = {0},
  citedby = {0},
  pages = {66-69},
  booktitle = {2022 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events, PerCom 2022 Workshops, Pisa, Italy, March 21-25, 2022},
  publisher = {IEEE},
  isbn = {978-1-6654-1647-4},
}