Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie. Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability, 44(2):275-285, 2004. [doi]
@article{RooneyCCAX04,
title = {Materials characterization of the effect of mechanical bending on area array package interconnects},
author = {Daniel T. Rooney and N. Todd Castello and Mike Cibulsky and Doug Abbott and Dongji Xie},
year = {2004},
doi = {10.1016/S0026-2714(03)00193-8},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00193-8},
researchr = {https://researchr.org/publication/RooneyCCAX04},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {44},
number = {2},
pages = {275-285},
}