A comparative evaluation of single-walled carbon nanotubes and copper in interconnects and Through-Silicon Vias - researchr publication authors

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Bassem Safieldeen, Hassan Mostafa, Hamdy Abd Elhamid, Yehea Ismail. A comparative evaluation of single-walled carbon nanotubes and copper in interconnects and Through-Silicon Vias. In 2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015, Cairo, Egypt, December 6-9, 2015. pages 519-522, IEEE, 2015. [doi]

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