Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits

A. Salas-Barenys, Neus Vidal, Javier J. Sieiro, José María López-Villegas, B. Medina-Rodriguez, F. M. Ramos. Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits. In 14th Conference on Ph.D. Research in Microelectronics and Electronics, PRIME 2018, Prague, Czech Republic, July 2-5, 2018. pages 265-268, IEEE, 2018. [doi]

@inproceedings{Salas-BarenysVS18,
  title = {Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits},
  author = {A. Salas-Barenys and Neus Vidal and Javier J. Sieiro and José María López-Villegas and B. Medina-Rodriguez and F. M. Ramos},
  year = {2018},
  doi = {10.1109/PRIME.2018.8430356},
  url = {https://doi.org/10.1109/PRIME.2018.8430356},
  researchr = {https://researchr.org/publication/Salas-BarenysVS18},
  cites = {0},
  citedby = {0},
  pages = {265-268},
  booktitle = {14th Conference on Ph.D. Research in Microelectronics and Electronics, PRIME 2018, Prague, Czech Republic, July 2-5, 2018},
  publisher = {IEEE},
  isbn = {978-1-5386-5387-6},
}