Rakshith Saligram, Suman Datta, Arijit Raychowdhury. Design Space Exploration of Interconnect Materials for Cryogenic Operation: Electrical and Thermal Analyses. IEEE Trans. Circuits Syst. I Regul. Pap., 69(11):4610-4618, 2022. [doi]
@article{SaligramDR22,
title = {Design Space Exploration of Interconnect Materials for Cryogenic Operation: Electrical and Thermal Analyses},
author = {Rakshith Saligram and Suman Datta and Arijit Raychowdhury},
year = {2022},
doi = {10.1109/TCSI.2022.3195636},
url = {https://doi.org/10.1109/TCSI.2022.3195636},
researchr = {https://researchr.org/publication/SaligramDR22},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Circuits Syst. I Regul. Pap.},
volume = {69},
number = {11},
pages = {4610-4618},
}