Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Cristiano Santos, Pascal Vivet, Ricardo Augusto da Luz Reis. Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 718-721, IEEE, 2014. [doi]

This author has not been identified. Look up 'Cristiano Santos' in GoogleThis author has not been identified. Look up 'Pascal Vivet' in GoogleThis author has not been identified. Look up 'Ricardo Augusto da Luz Reis' in Google

runs on WebDSL