Failure Analysis of Plastic Packages for Low-Power ICs

Sergio Saponara, Gabriele Ciarpi, Luca Fanucci. Failure Analysis of Plastic Packages for Low-Power ICs. In Alessandro De Gloria, editor, Applications in Electronics Pervading Industry, Environment and Society - APPLEPIES 2016, Rome, Italy, September 2016. Volume 429 of Lecture Notes in Electrical Engineering, pages 160-166, Springer, 2016. [doi]

@inproceedings{SaponaraCF16,
  title = {Failure Analysis of Plastic Packages for Low-Power ICs},
  author = {Sergio Saponara and Gabriele Ciarpi and Luca Fanucci},
  year = {2016},
  doi = {10.1007/978-3-319-55071-8_21},
  url = {https://doi.org/10.1007/978-3-319-55071-8_21},
  researchr = {https://researchr.org/publication/SaponaraCF16},
  cites = {0},
  citedby = {0},
  pages = {160-166},
  booktitle = {Applications in Electronics Pervading Industry, Environment and Society - APPLEPIES 2016, Rome, Italy, September 2016},
  editor = {Alessandro De Gloria},
  volume = {429},
  series = {Lecture Notes in Electrical Engineering},
  publisher = {Springer},
  isbn = {978-3-319-55071-8},
}