Comparison of power cycling and thermal cycling effects on the thermal impedance degradation in IGBT modules

Mohamed Sathik, King-Jet Tseng, Chandana Jayampathi Gajanayake, Rejeki Simanjorang, Amit Kumar Gupta. Comparison of power cycling and thermal cycling effects on the thermal impedance degradation in IGBT modules. In IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015. pages 1170-1175, IEEE, 2015. [doi]

@inproceedings{SathikTGSG15,
  title = {Comparison of power cycling and thermal cycling effects on the thermal impedance degradation in IGBT modules},
  author = {Mohamed Sathik and King-Jet Tseng and Chandana Jayampathi Gajanayake and Rejeki Simanjorang and Amit Kumar Gupta},
  year = {2015},
  doi = {10.1109/IECON.2015.7392258},
  url = {https://doi.org/10.1109/IECON.2015.7392258},
  researchr = {https://researchr.org/publication/SathikTGSG15},
  cites = {0},
  citedby = {0},
  pages = {1170-1175},
  booktitle = {IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015},
  publisher = {IEEE},
  isbn = {978-1-4799-1762-4},
}