Infineon Platform for SoC IO Ring and Package Design

Sathvik Tarikere Sathyanarayana, Anna-Antonia Berger, Mahesh Simpy Kumar, Akbay Erkan, Ramkrishna Paira. Infineon Platform for SoC IO Ring and Package Design. In 22nd International Symposium on Quality Electronic Design, ISQED 2021, Santa Clara, CA, USA, April 7-9, 2021. pages 318, IEEE, 2021. [doi]

@inproceedings{SathyanarayanaB21,
  title = {Infineon Platform for SoC IO Ring and Package Design},
  author = {Sathvik Tarikere Sathyanarayana and Anna-Antonia Berger and Mahesh Simpy Kumar and Akbay Erkan and Ramkrishna Paira},
  year = {2021},
  doi = {10.1109/ISQED51717.2021.9424351},
  url = {https://doi.org/10.1109/ISQED51717.2021.9424351},
  researchr = {https://researchr.org/publication/SathyanarayanaB21},
  cites = {0},
  citedby = {0},
  pages = {318},
  booktitle = {22nd International Symposium on Quality Electronic Design, ISQED 2021, Santa Clara, CA, USA, April 7-9, 2021},
  publisher = {IEEE},
  isbn = {978-1-7281-7641-3},
}