Stress and Temperature Simulation Using Copper-Diamond Composite Slug

Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Rizalafande Che Ismail, Nazuhusna Khalid, Mohd Fikri Che Husin, Hussin Kamarudin. Stress and Temperature Simulation Using Copper-Diamond Composite Slug. In David Al-Dabass, Alessandra Orsoni, Jasmy Yunus, Richard Cant, Zuwairie Ibrahim, editors, 15th International Conference on Computer Modelling and Simulation, UKSim 2013, Cambridge, United Kingdom, April 10-12, 2013. pages 299-303, IEEE, 2013. [doi]

@inproceedings{SauliRVIKHK13,
  title = {Stress and Temperature Simulation Using Copper-Diamond Composite Slug},
  author = {Zaliman Sauli and Vithyacharan Retnasamy and Rajendaran Vairavan and Rizalafande Che Ismail and Nazuhusna Khalid and Mohd Fikri Che Husin and Hussin Kamarudin},
  year = {2013},
  doi = {10.1109/UKSim.2013.151},
  url = {http://dx.doi.org/10.1109/UKSim.2013.151},
  researchr = {https://researchr.org/publication/SauliRVIKHK13},
  cites = {0},
  citedby = {0},
  pages = {299-303},
  booktitle = {15th International Conference on Computer Modelling and Simulation, UKSim 2013, Cambridge, United Kingdom, April 10-12, 2013},
  editor = {David Al-Dabass and Alessandra Orsoni and Jasmy Yunus and Richard Cant and Zuwairie Ibrahim},
  publisher = {IEEE},
  isbn = {978-1-4673-6421-8},
}