A roadmap of CAD tool changes for sub-micron interconnect problems - researchr publication bibtex

researchr

You are not signed in
Sign in
Sign up

Louis Scheffer. A roadmap of CAD tool changes for sub-micron interconnect problems. In ISPD. pages 104-109, 1997. [doi]

@inproceedings{Scheffer97,
  title = {A roadmap of CAD tool changes for sub-micron interconnect problems},
  author = {Louis Scheffer},
  year = {1997},
  doi = {10.1145/267665.267698},
  url = {http://doi.acm.org/10.1145/267665.267698},
  researchr = {https://researchr.org/publication/Scheffer97},
  cites = {0},
  citedby = {0},
  pages = {104-109},
  booktitle = {ISPD},
}

runs on WebDSL