Sensors at the Edge: Towards Micromechanical in-Memory Computing

Philip Schmitt, Martin Hoffmann. Sensors at the Edge: Towards Micromechanical in-Memory Computing. In IEEE International Conference on Omni-layer Intelligent Systems, COINS 2023, Berlin, Germany, July 23-25, 2023. pages 1-5, IEEE, 2023. [doi]

@inproceedings{SchmittH23,
  title = {Sensors at the Edge: Towards Micromechanical in-Memory Computing},
  author = {Philip Schmitt and Martin Hoffmann},
  year = {2023},
  doi = {10.1109/COINS57856.2023.10189322},
  url = {https://doi.org/10.1109/COINS57856.2023.10189322},
  researchr = {https://researchr.org/publication/SchmittH23},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International Conference on Omni-layer Intelligent Systems, COINS 2023, Berlin, Germany, July 23-25, 2023},
  publisher = {IEEE},
  isbn = {979-8-3503-4647-3},
}