A. Shah, A. Rezvani, M. Mayer, Y. Zhou, J. Persic, J. T. Moon. Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectronics Reliability, 51(1):67-74, 2011. [doi]
@article{ShahRMZPM11,
title = {Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding},
author = {A. Shah and A. Rezvani and M. Mayer and Y. Zhou and J. Persic and J. T. Moon},
year = {2011},
doi = {10.1016/j.microrel.2010.06.002},
url = {http://dx.doi.org/10.1016/j.microrel.2010.06.002},
researchr = {https://researchr.org/publication/ShahRMZPM11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {1},
pages = {67-74},
}