Chen Shang, Kai Wang, Hong Bao, Wei Wang 0361. A Unified Full-Field Deformation Measurement Approach for Plates With Different Thickness. IEEE T. Instrumentation and Measurement, 73:1-13, 2024. [doi]
@article{ShangWBW24,
title = {A Unified Full-Field Deformation Measurement Approach for Plates With Different Thickness},
author = {Chen Shang and Kai Wang and Hong Bao and Wei Wang 0361},
year = {2024},
doi = {10.1109/TIM.2024.3352698},
url = {https://doi.org/10.1109/TIM.2024.3352698},
researchr = {https://researchr.org/publication/ShangWBW24},
cites = {0},
citedby = {0},
journal = {IEEE T. Instrumentation and Measurement},
volume = {73},
pages = {1-13},
}