Jae Chang Shim, YeongSeo Ha, Jihee Park, Yeunghak Lee. PCB Micro-Soldering Status Inspection System Research based on Deep Learning. In Proceedings of the 5th Artificial Intelligence and Cloud Computing Conference, AICCC 2022, Osaka, Japan, December 17-19, 2022. pages 29-33, ACM, 2022. [doi]
@inproceedings{ShimHPL22,
title = {PCB Micro-Soldering Status Inspection System Research based on Deep Learning},
author = {Jae Chang Shim and YeongSeo Ha and Jihee Park and Yeunghak Lee},
year = {2022},
doi = {10.1145/3582099.3582104},
url = {https://doi.org/10.1145/3582099.3582104},
researchr = {https://researchr.org/publication/ShimHPL22},
cites = {0},
citedby = {0},
pages = {29-33},
booktitle = {Proceedings of the 5th Artificial Intelligence and Cloud Computing Conference, AICCC 2022, Osaka, Japan, December 17-19, 2022},
publisher = {ACM},
isbn = {978-1-4503-9874-9},
}