Dongjae Shin, Hyunil Byun, Dongshik Shim, Jungho Cha, Yonghwack Shin, Changgyun Shin, Chang Bum Lee, Eunkyung Lee, Jisan Lee, Inoh Hwang, Kyunghyun Son, Hyuck Choo, Kyoungho Ha. III/V-on-bulk-Si Platform: Born for DRAM, Transplanted to LiDAR. In European Conference on Optical Communication, ECOC 2021, Bordeaux, France, September 13-16, 2021. pages 1-3, IEEE, 2021. [doi]
@inproceedings{ShinBSCSSLLLHSC21,
title = {III/V-on-bulk-Si Platform: Born for DRAM, Transplanted to LiDAR},
author = {Dongjae Shin and Hyunil Byun and Dongshik Shim and Jungho Cha and Yonghwack Shin and Changgyun Shin and Chang Bum Lee and Eunkyung Lee and Jisan Lee and Inoh Hwang and Kyunghyun Son and Hyuck Choo and Kyoungho Ha},
year = {2021},
doi = {10.1109/ECOC52684.2021.9605700},
url = {https://doi.org/10.1109/ECOC52684.2021.9605700},
researchr = {https://researchr.org/publication/ShinBSCSSLLLHSC21},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {European Conference on Optical Communication, ECOC 2021, Bordeaux, France, September 13-16, 2021},
publisher = {IEEE},
isbn = {978-1-6654-3868-1},
}