Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration - researchr publication authors

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Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano. Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

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