Mohandass Sivakumar, Vaidyanathan Kripesh, Chong Ser Choong, Chai Tai Chong, Loon Aik Lim. Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Microelectronics Reliability, 42(9-11):1535-1540, 2002. [doi]
@article{SivakumarKCCL02,
title = {Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly},
author = {Mohandass Sivakumar and Vaidyanathan Kripesh and Chong Ser Choong and Chai Tai Chong and Loon Aik Lim},
year = {2002},
doi = {10.1016/S0026-2714(02)00185-3},
url = {http://dx.doi.org/10.1016/S0026-2714(02)00185-3},
tags = {reliability},
researchr = {https://researchr.org/publication/SivakumarKCCL02},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {42},
number = {9-11},
pages = {1535-1540},
}