Redundant Via insertion in SADP process with cut merging and optimization

Youngsoo Song, Jinwook Jung, Youngsoo Shin. Redundant Via insertion in SADP process with cut merging and optimization. In 2017 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017. pages 1-6, IEEE, 2017. [doi]

Authors

Youngsoo Song

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Jinwook Jung

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Youngsoo Shin

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