A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Tinus Stander. A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers. In AFRICON 2015, Addis Ababa, Ethiopia, September 14-17, 2015. pages 1-5, IEEE, 2015. [doi]

@inproceedings{Stander15a,
  title = {A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers},
  author = {Tinus Stander},
  year = {2015},
  doi = {10.1109/AFRCON.2015.7331937},
  url = {https://doi.org/10.1109/AFRCON.2015.7331937},
  researchr = {https://researchr.org/publication/Stander15a},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {AFRICON 2015, Addis Ababa, Ethiopia, September 14-17, 2015},
  publisher = {IEEE},
  isbn = {978-1-4799-7498-6},
}