Support envelopes: a technique for exploring the structure of association patterns

Michael Steinbach, Pang-Ning Tan, Vipin Kumar. Support envelopes: a technique for exploring the structure of association patterns. In Won Kim, Ron Kohavi, Johannes Gehrke, William DuMouchel, editors, Proceedings of the Tenth ACM SIGKDD International Conference on Knowledge Discovery and Data Mining, Seattle, Washington, USA, August 22-25, 2004. pages 296-305, ACM, 2004. [doi]

@inproceedings{SteinbachTK04,
  title = {Support envelopes: a technique for exploring the structure of association patterns},
  author = {Michael Steinbach and Pang-Ning Tan and Vipin Kumar},
  year = {2004},
  doi = {10.1145/1014052.1014086},
  url = {http://doi.acm.org/10.1145/1014052.1014086},
  researchr = {https://researchr.org/publication/SteinbachTK04},
  cites = {0},
  citedby = {0},
  pages = {296-305},
  booktitle = {Proceedings of the Tenth ACM SIGKDD International Conference on Knowledge Discovery and Data Mining, Seattle, Washington, USA, August 22-25, 2004},
  editor = {Won Kim and Ron Kohavi and Johannes Gehrke and William DuMouchel},
  publisher = {ACM},
  isbn = {1-58113-888-1},
}