Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Serguei Stoukatch, Jean-François Fagnard, François Dupont, Philippe Laurent, Marc Debliquy, Jean-Michel Redouté. Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. IEEE Access, 10:19242-19253, 2022. [doi]

@article{StoukatchFDLDR22,
  title = {Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors},
  author = {Serguei Stoukatch and Jean-François Fagnard and François Dupont and Philippe Laurent and Marc Debliquy and Jean-Michel Redouté},
  year = {2022},
  doi = {10.1109/ACCESS.2022.3151356},
  url = {https://doi.org/10.1109/ACCESS.2022.3151356},
  researchr = {https://researchr.org/publication/StoukatchFDLDR22},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {10},
  pages = {19242-19253},
}