Xiaodong Sun, Weiguo Hou, Yongming Liu. Thermal simulation analysis for an audio system of automobiles. In 2nd International Conference on System Reliability and Safety, ICSRS 2017, Milan, Italy, December 20-22, 2017. pages 292-295, IEEE, 2017. [doi]
@inproceedings{SunHL17-0,
title = {Thermal simulation analysis for an audio system of automobiles},
author = {Xiaodong Sun and Weiguo Hou and Yongming Liu},
year = {2017},
doi = {10.1109/ICSRS.2017.8272837},
url = {https://doi.org/10.1109/ICSRS.2017.8272837},
researchr = {https://researchr.org/publication/SunHL17-0},
cites = {0},
citedby = {0},
pages = {292-295},
booktitle = {2nd International Conference on System Reliability and Safety, ICSRS 2017, Milan, Italy, December 20-22, 2017},
publisher = {IEEE},
isbn = {978-1-5386-3322-9},
}