Yaofeng Sun, John H. L. Pang. Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectronics Reliability, 48(2):310-318, 2008. [doi]
@article{SunP08, title = {Digital image correlation for solder joint fatigue reliability in microelectronics packages}, author = {Yaofeng Sun and John H. L. Pang}, year = {2008}, doi = {10.1016/j.microrel.2007.03.007}, url = {http://dx.doi.org/10.1016/j.microrel.2007.03.007}, tags = {reliability}, researchr = {https://researchr.org/publication/SunP08}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {48}, number = {2}, pages = {310-318}, }