Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

Seiichi Takamatsu, Hisanori Takano, Nguyen Binh-Khiem, Tomoyuki Takahata, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama. Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors. Sensors, 10(6):5888-5898, 2010. [doi]

@article{TakamatsuTBTIMS10,
  title = {Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors},
  author = {Seiichi Takamatsu and Hisanori Takano and Nguyen Binh-Khiem and Tomoyuki Takahata and Eiji Iwase and Kiyoshi Matsumoto and Isao Shimoyama},
  year = {2010},
  doi = {10.3390/s100605888},
  url = {http://dx.doi.org/10.3390/s100605888},
  researchr = {https://researchr.org/publication/TakamatsuTBTIMS10},
  cites = {0},
  citedby = {0},
  journal = {Sensors},
  volume = {10},
  number = {6},
  pages = {5888-5898},
}