K. Takano, K. Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, Akifumi Kasamatsu, T. Yoshida, Shuhei Amakawa, Minoru Fujishima. 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. In 2018 IEEE Radio and Wireless Symposium, RWS 2018, Anaheim, CA, USA, January 15-18, 2018. pages 154-156, IEEE, 2018. [doi]
@inproceedings{TakanoKHDMTKYAF18,
title = {300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB},
author = {K. Takano and K. Katayama and S. Hara and R. Dong and K. Mizuno and K. Takahashi and Akifumi Kasamatsu and T. Yoshida and Shuhei Amakawa and Minoru Fujishima},
year = {2018},
doi = {10.1109/RWS.2018.8304972},
url = {https://doi.org/10.1109/RWS.2018.8304972},
researchr = {https://researchr.org/publication/TakanoKHDMTKYAF18},
cites = {0},
citedby = {0},
pages = {154-156},
booktitle = {2018 IEEE Radio and Wireless Symposium, RWS 2018, Anaheim, CA, USA, January 15-18, 2018},
publisher = {IEEE},
isbn = {978-1-5386-0710-7},
}