Effect of autoclave test on anisotropic conductive joints

C. W. Tan, Y. C. Chan, N. H. Yeung. Effect of autoclave test on anisotropic conductive joints. Microelectronics Reliability, 43(2):279-285, 2003. [doi]

@article{TanCY03,
  title = {Effect of autoclave test on anisotropic conductive joints},
  author = {C. W. Tan and Y. C. Chan and N. H. Yeung},
  year = {2003},
  doi = {10.1016/S0026-2714(02)00293-7},
  url = {http://dx.doi.org/10.1016/S0026-2714(02)00293-7},
  tags = {testing, C++},
  researchr = {https://researchr.org/publication/TanCY03},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {43},
  number = {2},
  pages = {279-285},
}