Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm

Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guo-Qi Zhang. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. IEEE Access, 5:16459-16468, 2017. [doi]

@article{TangYCQFZ17,
  title = {Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm},
  author = {Hongyu Tang and Huaiyu Ye and Xianping Chen and Cheng Qian and Xuejun Fan and Guo-Qi Zhang},
  year = {2017},
  doi = {10.1109/ACCESS.2017.2737638},
  url = {https://doi.org/10.1109/ACCESS.2017.2737638},
  researchr = {https://researchr.org/publication/TangYCQFZ17},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {5},
  pages = {16459-16468},
}