Reliability challenges for copper low-k dielectrics and copper diffusion barriers

Zs. Tökei, Y.-L. Li, G. P. Beyer. Reliability challenges for copper low-k dielectrics and copper diffusion barriers. Microelectronics Reliability, 45(9-11):1436-1442, 2005. [doi]

Authors

Zs. Tökei

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Y.-L. Li

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G. P. Beyer

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