A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link - researchr publication authors

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Andrew Townley, Nima Baniasadi, Sashank Krishnamurthy, Constantine Sideris, Ali Hajimiri, Elad Alon, Ali Niknejad. A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link. In 2020 IEEE Custom Integrated Circuits Conference, CICC 2020, Boston, MA, USA, March 22-25, 2020. pages 1-4, IEEE, 2020. [doi]

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