Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion

Du-Ming Tsai, Chih-Chieh Chang, Shin-Min Chao. Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion. Image Vision Comput., 28(3):491-501, 2010. [doi]

@article{TsaiCC10,
  title = {Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion},
  author = {Du-Ming Tsai and Chih-Chieh Chang and Shin-Min Chao},
  year = {2010},
  doi = {10.1016/j.imavis.2009.08.001},
  url = {http://dx.doi.org/10.1016/j.imavis.2009.08.001},
  researchr = {https://researchr.org/publication/TsaiCC10},
  cites = {0},
  citedby = {0},
  journal = {Image Vision Comput.},
  volume = {28},
  number = {3},
  pages = {491-501},
}