Hsien-Cheng Tseng, Pei-Hsuan Lee, Jung-Hua Chou. Improved Design of Thermal-Via Structures and Circuit Parameters for Advanced Collector-Up HBTs as Miniature High-Power Amplifiers. IEICE Transactions, 90-C(2):539-542, 2007. [doi]
@article{TsengLC07,
title = {Improved Design of Thermal-Via Structures and Circuit Parameters for Advanced Collector-Up HBTs as Miniature High-Power Amplifiers},
author = {Hsien-Cheng Tseng and Pei-Hsuan Lee and Jung-Hua Chou},
year = {2007},
doi = {10.1093/ietele/e90-c.2.539},
url = {http://dx.doi.org/10.1093/ietele/e90-c.2.539},
tags = {design},
researchr = {https://researchr.org/publication/TsengLC07},
cites = {0},
citedby = {0},
journal = {IEICE Transactions},
volume = {90-C},
number = {2},
pages = {539-542},
}