Akira Tsuchiya, Toshiyuki Inoue, Keiji Kishine, Yasuhiro Takahashi, Daisuke Ito, Makoto Nakamura. Capacitor Under Pad for Small Area Integration of High-Speed Signal-to-Differential Amplifier. In International Conference on Electronics, Information, and Communication, ICEIC 2022, Jeju, Korea, Republic of, February 6-9, 2022. pages 1-4, IEEE, 2022. [doi]
@inproceedings{TsuchiyaIKTIN22,
title = {Capacitor Under Pad for Small Area Integration of High-Speed Signal-to-Differential Amplifier},
author = {Akira Tsuchiya and Toshiyuki Inoue and Keiji Kishine and Yasuhiro Takahashi and Daisuke Ito and Makoto Nakamura},
year = {2022},
doi = {10.1109/ICEIC54506.2022.9748827},
url = {https://doi.org/10.1109/ICEIC54506.2022.9748827},
researchr = {https://researchr.org/publication/TsuchiyaIKTIN22},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {International Conference on Electronics, Information, and Communication, ICEIC 2022, Jeju, Korea, Republic of, February 6-9, 2022},
publisher = {IEEE},
isbn = {978-1-6654-0934-6},
}