P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai. Study of micro-BGA solder joint reliability. Microelectronics Reliability, 41(2):287-293, 2001. [doi]
@article{TuCHL01,
title = {Study of micro-BGA solder joint reliability},
author = {P. L. Tu and Y. C. Chan and K. C. Hung and J. K. L. Lai},
year = {2001},
doi = {10.1016/S0026-2714(00)00217-1},
url = {http://dx.doi.org/10.1016/S0026-2714(00)00217-1},
tags = {C++, reliability},
researchr = {https://researchr.org/publication/TuCHL01},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {41},
number = {2},
pages = {287-293},
}