Boris Vaisband, Eby G. Friedman. Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. on Circuits and Systems, 64(1):11-15, 2017. [doi]
@article{VaisbandF17,
title = {Hexagonal TSV Bundle Topology for 3-D ICs},
author = {Boris Vaisband and Eby G. Friedman},
year = {2017},
doi = {10.1109/TCSII.2016.2551552},
url = {http://dx.doi.org/10.1109/TCSII.2016.2551552},
researchr = {https://researchr.org/publication/VaisbandF17},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on Circuits and Systems},
volume = {64},
number = {1},
pages = {11-15},
}