Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle

Bo Wan, Ye Wang, Yutai Su, Guicui Fu. Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle. IEEE Access, 8:188154-188170, 2020. [doi]

@article{WanWSF20,
  title = {Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle},
  author = {Bo Wan and Ye Wang and Yutai Su and Guicui Fu},
  year = {2020},
  doi = {10.1109/ACCESS.2020.3031022},
  url = {https://doi.org/10.1109/ACCESS.2020.3031022},
  researchr = {https://researchr.org/publication/WanWSF20},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {8},
  pages = {188154-188170},
}