Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging

J. W. Wan, W. J. Zhang, D. J. Bergstrom. Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectronics Reliability, 48(3):425-430, 2008. [doi]

Authors

J. W. Wan

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W. J. Zhang

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D. J. Bergstrom

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