Jinlin Wang. Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle. Microelectronics Reliability, 42(2):293-299, 2002. [doi]
@article{Wang02:11,
title = {Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle},
author = {Jinlin Wang},
year = {2002},
doi = {10.1016/S0026-2714(01)00231-1},
url = {http://dx.doi.org/10.1016/S0026-2714(01)00231-1},
researchr = {https://researchr.org/publication/Wang02%3A11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {42},
number = {2},
pages = {293-299},
}