Separation of composite defect patterns on wafer bin map using support vector clustering

Chih-Hsuan Wang. Separation of composite defect patterns on wafer bin map using support vector clustering. Expert Syst. Appl., 36(2):2554-2561, 2009. [doi]

@article{Wang09f-1,
  title = {Separation of composite defect patterns on wafer bin map using support vector clustering},
  author = {Chih-Hsuan Wang},
  year = {2009},
  doi = {10.1016/j.eswa.2008.01.057},
  url = {http://dx.doi.org/10.1016/j.eswa.2008.01.057},
  researchr = {https://researchr.org/publication/Wang09f-1},
  cites = {0},
  citedby = {0},
  journal = {Expert Syst. Appl.},
  volume = {36},
  number = {2},
  pages = {2554-2561},
}