Jung-Chang Wang. U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method. Microelectronics Reliability, 54(6-7):1344-1354, 2014. [doi]
@article{Wang14-65,
title = {U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method},
author = {Jung-Chang Wang},
year = {2014},
doi = {10.1016/j.microrel.2014.02.034},
url = {http://dx.doi.org/10.1016/j.microrel.2014.02.034},
researchr = {https://researchr.org/publication/Wang14-65},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {6-7},
pages = {1344-1354},
}