Yibai Wang, Yiyang Liu. Loan Chain: A Blockchain-Based Framework for Smart Credit Lending. In 4th Blockchain and Internet of Things Conference, BIOTC 2022, Tokyo, Japan, July 8-10, 2022. pages 11-15, ACM, 2022. [doi]
@inproceedings{WangL22-154,
title = {Loan Chain: A Blockchain-Based Framework for Smart Credit Lending},
author = {Yibai Wang and Yiyang Liu},
year = {2022},
doi = {10.1145/3559795.3559797},
url = {https://doi.org/10.1145/3559795.3559797},
researchr = {https://researchr.org/publication/WangL22-154},
cites = {0},
citedby = {0},
pages = {11-15},
booktitle = {4th Blockchain and Internet of Things Conference, BIOTC 2022, Tokyo, Japan, July 8-10, 2022},
publisher = {ACM},
isbn = {978-1-4503-9662-2},
}