Li Wei, Andong Du, Yuan Fang. Establishment of cure kinetic model and study on reaction mechanism of resin-based thermal insulation coatings. IJSPM, 12(3/4):347-355, 2017. [doi]
@article{WeiDF17,
title = {Establishment of cure kinetic model and study on reaction mechanism of resin-based thermal insulation coatings},
author = {Li Wei and Andong Du and Yuan Fang},
year = {2017},
doi = {10.1504/IJSPM.2017.10006504},
url = {https://doi.org/10.1504/IJSPM.2017.10006504},
researchr = {https://researchr.org/publication/WeiDF17},
cites = {0},
citedby = {0},
journal = {IJSPM},
volume = {12},
number = {3/4},
pages = {347-355},
}