Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon. Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. Microelectronics Reliability, 78:319-330, 2017. [doi]
@article{WeiHYSKM17,
title = {Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method},
author = {Hsiu-Ping Wei and Bongtae Han and Byeng Dong Youn and Hyuk Shin and Ilho Kim and Hojeong Moon},
year = {2017},
doi = {10.1016/j.microrel.2017.09.006},
url = {https://doi.org/10.1016/j.microrel.2017.09.006},
researchr = {https://researchr.org/publication/WeiHYSKM17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {78},
pages = {319-330},
}