A review of board level solder joints for mobile applications

E. H. Wong, S. K. W. Seah, V. P. W. Shim. A review of board level solder joints for mobile applications. Microelectronics Reliability, 48(11-12):1747-1758, 2008. [doi]

Authors

E. H. Wong

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S. K. W. Seah

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V. P. W. Shim

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