Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties

Mei-Ling Wu, Donald Barker. Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties. Microelectronics Reliability, 50(1):140-148, 2010. [doi]

@article{WuB10-8,
  title = {Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties},
  author = {Mei-Ling Wu and Donald Barker},
  year = {2010},
  doi = {10.1016/j.microrel.2009.09.006},
  url = {http://dx.doi.org/10.1016/j.microrel.2009.09.006},
  researchr = {https://researchr.org/publication/WuB10-8},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {50},
  number = {1},
  pages = {140-148},
}