Bo Wu, Wai Chung Liu. Photoclinometry and Photogrammetry Integrated Approach for Pixel-Resolution 3D Mapping and Applications in China's Lunar Landing Missions. In 2019 IEEE International Geoscience and Remote Sensing Symposium, IGARSS 2019, Yokohama, Japan, July 28 - August 2, 2019. pages 5011-5012, IEEE, 2019. [doi]
@inproceedings{WuL19-35,
title = {Photoclinometry and Photogrammetry Integrated Approach for Pixel-Resolution 3D Mapping and Applications in China's Lunar Landing Missions},
author = {Bo Wu and Wai Chung Liu},
year = {2019},
doi = {10.1109/IGARSS.2019.8900591},
url = {https://doi.org/10.1109/IGARSS.2019.8900591},
researchr = {https://researchr.org/publication/WuL19-35},
cites = {0},
citedby = {0},
pages = {5011-5012},
booktitle = {2019 IEEE International Geoscience and Remote Sensing Symposium, IGARSS 2019, Yokohama, Japan, July 28 - August 2, 2019},
publisher = {IEEE},
isbn = {978-1-5386-9154-0},
}