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Design and Comparison of High-Reliable Radiation-Hardened Flip-Flops Under SMIC 40nm Process

Bingbing Xia, Jun Wu, Hongjin Liu, Kai Zhou, Zhifu Miao. Design and Comparison of High-Reliable Radiation-Hardened Flip-Flops Under SMIC 40nm Process. Journal of Circuits, Systems, and Computers, 25(12):1-19, 2016. [doi]

Authors

Bingbing Xia

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Jun Wu

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Hongjin Liu

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Kai Zhou

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Zhifu Miao

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